Product introduction:
Leetop_ ALP_ 680 is an embedded artificial intelligence computer developed based on the NVIDIA AGX Orin module, which can provide up to 200/275TOPS of computing power to numerous terminal devices. Jetson AGX Orin can be combined with NVIDIA's powerful AI software stack/SDK and software platform. As a high- performance and low-power embedded edge computing device, it is mainly used in advanced artificial intelligence robots, edge detection devices and AI application scenarios in manufacturing, logistics, retail, service, agriculture, smart cities, healthcare, life sciences and other fields Leetop_ ALP_ 680 provides a fast active heat dissipation design that can meet industrial standards such as earthquake resistance and anti-static. Meanwhile, Leetop_ ALP_ 680 interface is rich and cost- effective.
Product specification：
Processor module：
| specifications | ||
| Module | Jetson AGX Orin 32GB | Jetson AGX Orin 64GB |
| AI Performance | 200 TOPS | 275 TOPS |
| CPU |
1792-core NVIDIA Ampere GPU with56 Tensor Cores |
2048-core NVIDIA Ampere GPU with 64 Tensor Cores |
| GPU |
8-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU2MB L2 + 4MB L3 |
12-core NVIDIA Arm® Cortex A78AE v8.2 64- bit CPU 3MB L2 + 6MB L3 |
| Memory |
32 GB 256-bit LPDDR5 204.8 GB/s |
64GB 256-bit LPDDR5 204.8 GB/s |
| Storage | 64GB eMMC 5.1 | |
| Video Encode |
1x 4K60 (H.265) 3x 4K30 (H.265) 6x 1080p60 (H.265) 12x 1080p30 (H.265) |
2x 4K60 (H.265) 4x 4K30 (H.265) 8x 1080p60 (H.265) 16x 1080p30 (H.265) |
| Video Decode |
1x 8K30 (H.265) 2x 4K60 (H.265) 4x 4K30 (H.265) 9x 1080p60 (H.265) 18x 1080p30 (H.265) |
1x 8K30 (H.265) 3x 4K60 (H.265) 7x 4K30 (H.265) 11x 1080p60 (H.265) 22x 1080p30 (H.265) |
| Power | 15W - 40W | 15W - 60W |
Product specification：
| Interface | Specification |
| Network | 5x Gigabit Ethernet(10/100/1000) W2 2x2PSEO ptional) |
| 1x10G | |
| USB | 6x USB 3.0 Type A (Integrated USB 2.0) 1x USB2.0+3.2Type C |
| Video output | 1 × HDMI |
| Audio | 1xAudio |
| Misc. |
1×RS232;2×CAN;1×I2C(+3.3V ) ;1xI2S(+3.3V) ;6×GPIO(+3.3V); 2×GPIO(+12V);1×GPIO(+5V); 1×RS485;1×UART(+3.3V);1×SPI(+3.3V) |
| SIM_Card | 1xSIM_Card |
| TF_Card | 1xTF_Card |
| Camera | 1xMIPI (MIPI转6xCSI Camera) |
| Function key | 1x Power key; 1xRecovery key ; 1xReset key; |
| DC | Power interface |
| Project | Spec |
| Input Voltage | +12---+36V(150W) DC Input |
| Load capacity | Above 90W |
| Dimensions (W×D ×H) | 319.8x197.2x85.4(mm) |
| Operating Temperature | -25℃-70℃ |
| Storage Temperature/Humidity | -25℃-65℃/10% -90% non condensation environment |
| Weight | 4KG |
Schematic diagram of dimensions：
| Front view | Left view |
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| Up view | Rear view |
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