Product introduction：
Leetop_ALP_603_F is an embedded artificial intelligencecomputer developed based on the NVIDIA Orin Nano/Orin Nxcore board，which can provide up to 20/40/70/100TOPS computingpower for many terminal devices. Leetop_ALP_603_F provides afast active cooling design, which can meet industrial standardssuch as shock resistance and anti-static. At the same timeLeetop_ALP_603_F has rich interfaces and high costperformance.
Product Specifications
processor module
| Jetson Orin Nano 4GB | Jetson Orin Nano 8GB | |
| AI Performance | 20 TOPS | 40 TOPS |
| GPU | 512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores | 1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores |
| CPU | 6-core Arm® Cortex®-A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 | |
| Video Encode | 1080p30 supported by 1-2 CPU cores | |
| Video Decode |
1x 4K60 (H.265) 2x 4K30 (H.265) 5x 1080p60 (H.265) 11x 1080p30 (H.265) |
|
| Memory | 4GB 64-bit LPDDR5 34 GB/s | 8GB 128-bit LPDDR5 68 GB/s |
| Storage |
— (Supports external NVMe) |
|
| Jetson Orin NX 8GB | NX 8GB Jetson Orin NX 16GB | |
| AI Performance | 70 TOPS | 100 TOPS |
| GPU | 1024-core NVIDIA Ampere GPU with 32 Tensor Cores | |
| CPU | 6-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 | 8-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 |
| Video Encode | 1x 4K60 | 3x 4K30 | 6x 1080p60 | 12x 1080p30 (H.265) 1x 4K60 | 2x 4K30 | 5x 1080p60 | 11x 1080p30 (H.264) | |
| Video Decode | 1x 8K30 | 2x 4K60 | 4x 4K30 | 9x 1080p60| 18x 1080p30 (H.265) 1x 4K60 | 2x 4K30 | 5x 1080p60 | 11x 1080p30 (H.264) | |
| Memory | 8 GB 128-bit LPDDR5 102.4 GB/s | 16 GB 128-bit LPDDR5 102.4 GB/s |
| Storage |
— (Supports external NVMe) |
|
I/O
| Interface | Specification |
| Network | 1 × Gigabit Ethernet Connector (10/100/1000) |
| USB | 2x USB 3.0 Type A (Integrated USB 2.0) 1x USB 3.0 0.5mm pitch 20P ZIF 1x USB 2.0 Micro-AB |
| Video output | 1 × HDMI |
| SIM Card | 1x SIM Card |
| CAN | 1 × CAN |
| RS232 | 1x RS232 |
| power | +9V to +20V DC Input @ 7A |
Power Supply
| Power Supply | Spec |
| Input Voltage | +9--+20V DC Input @7A |
| Power consumption | Above 60W |
Mechanical
| Mechanical | Spec |
| Dimensions (W×D ×H) | 100x59x51(mm) |
| Weight | 0.4KG |
Environmental
| Environmenta | Spec |
| Operating Temperature | -25℃-65℃ 0.2~0.3m/s Turbulence |
| Storage Humidity | -20℃-60℃ |
| Storage Humidity | 10%-90% Non-condensing environment |
Schematic diagram of dimensions
| Front view | Left view |
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| Up view | Bottom view |
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Matching table
| Product name | Core module | SSD | communication | power |
| ALP_603_F | ||||
| J1:Orin Nano(4G) | ||||
| J2:Orin Nano(8G) | ||||
| J3:Orin NX(8G) | ||||
| J4:Orin NX(16G) | ||||
| N | ||||
| 128G | ||||
| 256G | ||||
| 512G | ||||
| 1T | ||||
| N | ||||
| 4G | ||||
| 5G | ||||
| N | ||||
| 01:Ming Wai | ||||
| 02:Customisation |
