Product introduction:
Leetop_ ALP_ 203_ F2 is an embedded artificial intelligence computer developed based on the NVIDIA Xavier NX/TX2 NX/ NANO core module, which can provide up to 21TOPS/1.33 TFLOPS/ 472 GFLOPS of computing power to numerous terminal devices. Jetson Xavier NX can be combined with NVIDIA's powerful AI software stack/SDK and software platform. As a high- performance and low-power embedded edge computing device, it is mainly used in advanced AI robots, edge detection equipment and AI application scenarios in manufacturing, logistics, retail, service, agriculture, smart city, healthcare, life science and other fields. Leetop_ AL P_ 203_ F2 provides a fast active heat dissipation design that can meet industrial standards such as seismic and anti- static performance. At the same time, L eetop_ ALP_ 203_ The F2 interface is rich and cost-effective.
Product specification：
Processor module：
| Jetson Xavier NX | Jetson Xavier NX 16GB | |
| AI Performance | 21 TOPS | |
| GPU | 384-core NVIDIA Volta ™ GPU with 48 Tensor Cores | |
| CPU | 6-core NVIDIA Carmel Arm®v8.2 64-bit CPU 6MB L2 + 4MB L3 | |
| Video Encode |
2x 4K60 | 4x 4K30 | 10x 1080p60 |22x1080p30 (H.265) 2x 4K60 | 4x 4K30 | 10x 1080p60 |20x108p30 (H.264) |
|
| Video Decode | 2x 8K30 | 6x 4K60 | 12x 4K30 | 22x1080p60 | 44x 1080p30 (H.265) 2x 4K60 | | |
| Memory | 8 GB 128-bit LPDDR4x59.7GB/s | 16 GB 128-bit LPDDR4x 59.7GB/s |
| Storage | 16 GB eMMC 5.1 * | |
|
Jetson NANO |
Jetson TX2 NX |
|
|
AI Performance |
472 GFLOPS |
1.33 TFLOPS |
|
GPU |
128-core NVIDIA Maxwell™ architecture GPU |
256-core NVIDIA Pascal™ architecture GPU |
|
CPU |
Quad-Core Arm® Cortex®-A57 MPCore processor |
Dual-Core NVIDIA Denver 2 64- Bit CPU and Quad-Core Arm® Cortex®-A57 MPCore processor |
|
Video Encode |
1x 4K30 (H.265) 2x 1080p60 (H.265) |
1x 4K60 (H.265) 3x 4K30 (H.265) 4x 1080p60 (H.265) |
|
Video Decode |
1x 4K60 (H.265) 4x 1080p60 (H.265) |
2x 4K60 (H.265) 7x 1080p60 (H.265) 14x 1080p30 (H.265) |
|
Memory |
4GB 64-bit LPDDR4 25.6GB/s" |
4GB 128-bit LPDDR4 51.2GB/s |
|
Storage |
16 GB eMMC 5.1 * |
16 GB eMMC 5.1 |
Product specification：
| Interface |
Specification |
| Network | 1 × Gigabit Ethernet Connector (10/100/1000) |
| USB |
2x USB 3.0 Type A (Integrated USB2.0)1X USB 3.0 1x USB 2.0 Micro-AB |
| Video
output |
1✖HDMI |
| SIM Card | 1x SIM Card |
| CAN | 1 × CAN |
| RS232 | 1x RS232 |
| TF_Card | 1xTF_Card |
| Function key | 1xReset key; 1x Recovery key |
| Project |
Specification |
| Input Voltage | +9V to +19V DC Input @ 3A |
| Load capacity | Above 60W |
|
Dimensions (W×D ×H) |
94x92x51 (mm) |
|
Operating Temperature |
-25℃-65℃ 0.2~0.3m/airflows |
|
Storage Temperature |
-20℃-60℃ |
| Weight |
0.390KG |
Schematic diagram of dimensions：
| Front view | Left view |
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| Up view | Right view |
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