Product introduction:
Leetop_ALP_206 is an embedded artificial intelligencecomputer developed based on the NVIDIA jetson XavierNX/Nano/TX2 NX core board, which can provide computingpower up to 472 GFLOPs/1.33 TFLOPs/21TOPS for many terminaldevices. Leetop ALP 206 provides a fast passive heat dissipationdesign, which can meet industrial standards such as shockresistance and anti-static. At the same time, Leetop_ALP 206has rich interfaces and high cost performance
Product Specifications
processor module
Jetson Xavier NX 8GB | Jetson Xavier NX 16GB | |
AI Performance | 21 TOPS | |
GPU | 384-core NVIDIA Volta™ GPU with 48 Tensor Cores | |
CPU | 6-core NVIDIA Carmel Arm®v8.2 64-bit CPU 6MB L2 + 4MB L3 | |
Video Encode | 2x 4K60 | 4x 4K30 | 10x 1080p60 | 22x 1080p30 (H.265) 2x 4K60 | 4x 4K30 | 10x 1080p60 | 20x 108p30 (H.264) | |
Video Decode | 2x 8K30 | 6x 4K60 | 12x 4K30 | 22x 1080p60 | 44x 1080p30 (H.265) 2x 4K60 | 6x 4K30 | 10x 1080p60 | 22x 1080p30 (H.264) | |
Memory | 8 GB 128-bit LPDDR4x 59.7GB/s | 16 GB 128-bit LPDDR4x 59.7GB/s |
Storage | 16 GB eMMC 5.1 * |
Jetson Nano | Jetson Tx2 NX | |
AI Performance | 472 GFLOPs | 1.33 TFLOPs |
GPU | 128-core NVIDIA Maxwell™ GPU | 256-core NVIDIA Pascal™ GPU |
CPU | Quad-Core Arm® Cortex®-A57 MPCore processor | Dual-Core NVIDIA Denver 2 64-Bit CPU and Quad-Core Arm® Cortex®-A57 MPCore processor |
Video Encode | 1x 4K30 2x1080p60 4x1080p30 4x720p60 9x720p30 (H.265 & H.264) | 1x 4K60 3x 4K30 4x 1080p60 8x 1080p30 (H.265) 1x 4K60 3x 4K30 7x 1080p60 14x 1080p30 (H.264) |
Video Decode | 1x 4K60 2x 4K30 4x 1080p60 8x 1080p30 9x 720p60 (H.265 & H.264) | 2x 4K60 4x 4K30 7x 1080p60 14x 1080p30 (H.265 & H.264) |
Memory | 4 GB 64-bit LPDDR4 25.6GB/s | 4 GB 128-bit LPDDR4 51.2GB/s |
Storage | 16GB eMMC 5.1 | 16 GB eMMC 5.1 |
I/O
Interface | Interface Specification |
Network | 1 × Gigabit Ethernet Connector (10/100/1000) |
USB | 4x USB 3.0 Type A (Integrated USB 2.0) 1x USB 2.0Type C |
Video output | 1 × HDMI |
Camera | 2x Camera |
CAN | 1 × CAN 1CAN(Receive. Transceiver) |
SPI Bus 1 × SPI Bus(+3.3V Level) | 1 × SPI Bus(+3.3V Level) |
Power | +13---+19V DC Input @ 8A |
Power Supply
Power Supply | Spec |
Input Voltage | +13---+19V DC Input @ 8A |
Power consumption | 45W |
Mechanical
Mechanical | Spec |
Dimensions (W×D ×H) | 116x86.7x40.1(mm) |
Weight | 0.67KG |
Environmental
Environmenta | Spec |
Operating Temperature | -20℃-70℃ |
Storage Humidity | 10%-90%Non-condensing environment |
Schematic diagram of dimensions
Front view | Left view |
Up view | Bottom view |
Matching table
Product name | Core module | SSD | communication | power |
ALP_206 | ||||
J1:Nano | ||||
J2:Xavier NX(8G) | ||||
J3:Xavier NX(16G) | ||||
J4:TX2 NX | ||||
N | ||||
128G | ||||
256G | ||||
512G | ||||
1T | ||||
N | ||||
N | ||||
01:Ming Wai | ||||
02:Customisation |